Ju Dy Lim, Susan Yeow Su Yi, MinWoo Daniel Rhee, Kam Chew Leong, Chee Cheong Wong. Surface roughness effect on copper-alumina adhesion. Microelectronics Reliability, 53(9-11):1548-1552, 2013. [doi]
@article{LimYRLW13,
title = {Surface roughness effect on copper-alumina adhesion},
author = {Ju Dy Lim and Susan Yeow Su Yi and MinWoo Daniel Rhee and Kam Chew Leong and Chee Cheong Wong},
year = {2013},
doi = {10.1016/j.microrel.2013.07.016},
url = {http://dx.doi.org/10.1016/j.microrel.2013.07.016},
researchr = {https://researchr.org/publication/LimYRLW13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {9-11},
pages = {1548-1552},
}