Surface roughness effect on copper-alumina adhesion

Ju Dy Lim, Susan Yeow Su Yi, MinWoo Daniel Rhee, Kam Chew Leong, Chee Cheong Wong. Surface roughness effect on copper-alumina adhesion. Microelectronics Reliability, 53(9-11):1548-1552, 2013. [doi]

Abstract

Abstract is missing.