C. Y. Lin, U. E. Avci, M. A. Blount, R. Grover, J. Hicks, R. Kasim, A. Kundu, C. M. Pelto, C. Ryder, Anthony Schmitz, K. Sethi, D. Seghete, D. J. Towner, A. J. Welsh, J. Weber, C. Auth. Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process. In 2020 IEEE International Reliability Physics Symposium, IRPS 2020, Dallas, TX, USA, April 28 - May 30, 2020. pages 1-4, IEEE, 2020. [doi]
Abstract is missing.