Chin-Tsai Lin, Che-Wei Chang, Chie-Bein Chen. Focus groups: impact of quality and process capability factors on the silicon wafer slicing process. IJMTM, 6(1/2):171-184, 2004. [doi]
@article{LinCC04:0,
title = {Focus groups: impact of quality and process capability factors on the silicon wafer slicing process},
author = {Chin-Tsai Lin and Che-Wei Chang and Chie-Bein Chen},
year = {2004},
doi = {10.1504/IJMTM.2004.004513},
url = {http://dx.doi.org/10.1504/IJMTM.2004.004513},
tags = {slicing},
researchr = {https://researchr.org/publication/LinCC04%3A0},
cites = {0},
citedby = {0},
journal = {IJMTM},
volume = {6},
number = {1/2},
pages = {171-184},
}