The following publications are possibly variants of this publication:
- Effect of substrate flexibility on solder joint reliabilityXingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard. mr, 42(12):1883-1891, 2002. [doi]
- Finite element modeling on electromigration of solder joints in wafer level packagesP. Dandu, X. J. Fan, Y. Liu, C. Diao. mr, 50(4):547-555, 2010. [doi]
- Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive loadTz-Cheng Chiu, Jyun-Ji Lin, Hung-Chun Yang, Vikas Gupta. mr 2010: 2037-2050 [doi]
- Stacked solder bumping technology for improved solder joint reliabilityXingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard. mr, 41(12):1979-1992, 2001. [doi]