Development of the green plastic encapsulation for high density wirebonded leaded packages

T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua. Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability, 43(5):811-817, 2003. [doi]

Authors

T. Y. Lin

This author has not been identified. Look up 'T. Y. Lin' in Google

C. M. Fang

This author has not been identified. Look up 'C. M. Fang' in Google

Y. F. Yao

This author has not been identified. Look up 'Y. F. Yao' in Google

K. H. Chua

This author has not been identified. Look up 'K. H. Chua' in Google