Development of the green plastic encapsulation for high density wirebonded leaded packages

T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua. Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability, 43(5):811-817, 2003. [doi]

Abstract

Abstract is missing.