T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua. Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability, 43(5):811-817, 2003. [doi]
@article{LinFYC03,
title = {Development of the green plastic encapsulation for high density wirebonded leaded packages},
author = {T. Y. Lin and C. M. Fang and Y. F. Yao and K. H. Chua},
year = {2003},
doi = {10.1016/S0026-2714(03)00061-1},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00061-1},
tags = {C++},
researchr = {https://researchr.org/publication/LinFYC03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {5},
pages = {811-817},
}