A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing

Tung-Ho Lin, Ming-Hsiung Hung, Rung-Chuan Lin, Fan-Tien Cheng. A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing. In Proceedings of the 2006 IEEE International Conference on Robotics and Automation, ICRA 2006, May 15-19, 2006, Orlando, Florida, USA. pages 1054-1059, IEEE, 2006.

Authors

Tung-Ho Lin

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Ming-Hsiung Hung

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Rung-Chuan Lin

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Fan-Tien Cheng

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