Tung-Ho Lin, Ming-Hsiung Hung, Rung-Chuan Lin, Fan-Tien Cheng. A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing. In Proceedings of the 2006 IEEE International Conference on Robotics and Automation, ICRA 2006, May 15-19, 2006, Orlando, Florida, USA. pages 1054-1059, IEEE, 2006.
Abstract is missing.