Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment - researchr publication authors

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M. H. Lin, Y.-L. Lin, K. P. Chang, K. C. Su, Tahui Wang. Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectronics Reliability, 45(7-8):1061-1078, 2005. [doi]

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