Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment

M. H. Lin, Y.-L. Lin, K. P. Chang, K. C. Su, Tahui Wang. Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. Microelectronics Reliability, 45(7-8):1061-1078, 2005. [doi]

Abstract

Abstract is missing.