Y.-H. Lin, C. C. Lee, C.-Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao. A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-4, IEEE, 2023. [doi]
Abstract is missing.