Ye-Lin, Chuan Seng Tan. Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
@inproceedings{LinT16-4,
title = {Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element},
author = {Ye-Lin and Chuan Seng Tan},
year = {2016},
doi = {10.1109/3DIC.2016.7970003},
url = {https://doi.org/10.1109/3DIC.2016.7970003},
researchr = {https://researchr.org/publication/LinT16-4},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1399-9},
}