Weak Die Screening by Feature Prioritized Random Forest for Improving Semiconductor Quality and Reliability

Shian-Yu Lin, Pai-Yu Tan, Cheng-Wen Wu, Ming-Der Shieh, Chien-Hui Chuang, Gordon Liao. Weak Die Screening by Feature Prioritized Random Forest for Improving Semiconductor Quality and Reliability. In IEEE International Test Conference in Asia, ITC-Asia 2022, Taipei, Taiwan, August 24-26, 2022. pages 25-30, IEEE, 2022. [doi]

Abstract

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