Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution

Torsten Linz, Malte von Krshiwoblozki, Hans Walter. Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution. In International Conference on Body Sensor Networks, BSN 2010, Singapore, 7-9 June, 2010. pages 308-314, IEEE, 2010. [doi]

Authors

Torsten Linz

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Malte von Krshiwoblozki

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Hans Walter

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