Torsten Linz, Malte von Krshiwoblozki, Hans Walter. Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution. In International Conference on Body Sensor Networks, BSN 2010, Singapore, 7-9 June, 2010. pages 308-314, IEEE, 2010. [doi]
@inproceedings{LinzKW10,
title = {Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution},
author = {Torsten Linz and Malte von Krshiwoblozki and Hans Walter},
year = {2010},
doi = {10.1109/BSN.2010.56},
url = {http://doi.ieeecomputersociety.org/10.1109/BSN.2010.56},
researchr = {https://researchr.org/publication/LinzKW10},
cites = {0},
citedby = {0},
pages = {308-314},
booktitle = {International Conference on Body Sensor Networks, BSN 2010, Singapore, 7-9 June, 2010},
publisher = {IEEE},
isbn = {978-1-4244-5817-2},
}