Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution

Torsten Linz, Malte von Krshiwoblozki, Hans Walter. Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution. In International Conference on Body Sensor Networks, BSN 2010, Singapore, 7-9 June, 2010. pages 308-314, IEEE, 2010. [doi]

References

No references recorded for this publication.

Cited by

No citations of this publication recorded.