Seeking the Yield Barrier: High-Dimensional SRAM Evaluation Through Optimal Manifold

Yanfang Liu, Guohao Dai, Wei W. Xing. Seeking the Yield Barrier: High-Dimensional SRAM Evaluation Through Optimal Manifold. In 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023. pages 1-6, IEEE, 2023. [doi]

Abstract

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