Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures

Yunting Liu, Rong Fu, Meiying Su, Jun Li, Chuan Chen, Fengman Liu. Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures. Microelectronics Journal, 161:106714, 2025. [doi]

Abstract

Abstract is missing.