Compact thermal modeling for packaged microprocessor design with practical power maps

Zao Liu, Sheldon X.-D. Tan, Hai Wang, Yingbo Hua, Ashish Gupta 0007. Compact thermal modeling for packaged microprocessor design with practical power maps. Integration, 47(1):71-85, 2014. [doi]

Authors

Zao Liu

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Sheldon X.-D. Tan

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Hai Wang

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Yingbo Hua

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Ashish Gupta 0007

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