Zao Liu, Sheldon X.-D. Tan, Hai Wang, Yingbo Hua, Ashish Gupta 0007. Compact thermal modeling for packaged microprocessor design with practical power maps. Integration, 47(1):71-85, 2014. [doi]
@article{LiuTWH014,
title = {Compact thermal modeling for packaged microprocessor design with practical power maps},
author = {Zao Liu and Sheldon X.-D. Tan and Hai Wang and Yingbo Hua and Ashish Gupta 0007},
year = {2014},
doi = {10.1016/j.vlsi.2013.07.003},
url = {http://dx.doi.org/10.1016/j.vlsi.2013.07.003},
researchr = {https://researchr.org/publication/LiuTWH014},
cites = {0},
citedby = {0},
journal = {Integration},
volume = {47},
number = {1},
pages = {71-85},
}