Jingyu Liu, Yongyong Wang, Xunyong Yang, Fashun Yang, Kui Ma. Analytical model of internal heat transfer of a power chip with through silicon via. In Yajie Qin, Zhiliang Hong, Ting-Ao Tang, editors, 12th IEEE International Conference on ASIC, ASICON 2017, Guiyang, China, October 25-28, 2017. pages 588-591, IEEE, 2017. [doi]
Abstract is missing.