Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV)

Yang Liu 0106, Zhangming Zhu, Xiaoxian Liu, Huaxi Gu, Lixin Guo. Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV). IEICE Electronic Express, 15(24):20180878, 2018. [doi]

Abstract

Abstract is missing.