Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu Fujita, Luca Benini. A low-overhead fault tolerance scheme for TSV-based 3D network on chip links. In Sani R. Nassif, Jaijeet S. Roychowdhury, editors, 2008 International Conference on Computer-Aided Design (ICCAD 08), November 10-13, 2008, San Jose, CA, USA. pages 598-602, IEEE, 2008. [doi]
@inproceedings{LoiMLFB08,
title = {A low-overhead fault tolerance scheme for TSV-based 3D network on chip links},
author = {Igor Loi and Subhasish Mitra and Thomas H. Lee and Shinobu Fujita and Luca Benini},
year = {2008},
doi = {10.1145/1509456.1509589},
url = {http://doi.acm.org/10.1145/1509456.1509589},
tags = {rule-based},
researchr = {https://researchr.org/publication/LoiMLFB08},
cites = {0},
citedby = {0},
pages = {598-602},
booktitle = {2008 International Conference on Computer-Aided Design (ICCAD 08), November 10-13, 2008, San Jose, CA, USA},
editor = {Sani R. Nassif and Jaijeet S. Roychowdhury},
publisher = {IEEE},
isbn = {978-1-4244-2820-5},
}