A low-overhead fault tolerance scheme for TSV-based 3D network on chip links

Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu Fujita, Luca Benini. A low-overhead fault tolerance scheme for TSV-based 3D network on chip links. In Sani R. Nassif, Jaijeet S. Roychowdhury, editors, 2008 International Conference on Computer-Aided Design (ICCAD 08), November 10-13, 2008, San Jose, CA, USA. pages 598-602, IEEE, 2008. [doi]

Abstract

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