Lukasz Lopacinski, Mohamed Hussein Eissa, Goran Panic, Alireza Hasani, R. Kraemer. Modular Data Link Layer Processing for THz communication. In 22nd IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2019, Cluj-Napoca, Romania, April 24-26, 2019. pages 1-5, IEEE, 2019. [doi]
Abstract is missing.