Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology

Lukasz Lopacinski, Miroslav Marinkovic, Goran Panic, Mohamed Hussein Eissa, Alireza Hasani, Karthik KrishneGowda, Rolf Kraemer. Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology. IEEE Access, 7:44489-44502, 2019. [doi]

@article{LopacinskiMPEHK19,
  title = {Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology},
  author = {Lukasz Lopacinski and Miroslav Marinkovic and Goran Panic and Mohamed Hussein Eissa and Alireza Hasani and Karthik KrishneGowda and Rolf Kraemer},
  year = {2019},
  doi = {10.1109/ACCESS.2019.2907156},
  url = {https://doi.org/10.1109/ACCESS.2019.2907156},
  researchr = {https://researchr.org/publication/LopacinskiMPEHK19},
  cites = {0},
  citedby = {0},
  journal = {IEEE Access},
  volume = {7},
  pages = {44489-44502},
}