Jean-Etienne Lorival, Francis Calmon, Fengyuan Sun, Felipe Frantz, Carole Plossu, Martine Le Berre, Ian O'Connor, Olivier Valorge, Jean Charbonnier, David Henry, Christian Gontrand. An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration. Microelectronics Journal, 46(2):153-165, 2015. [doi]
Abstract is missing.