A Tale of Two Sides of Wafer: Physical Implementation and Block-Level PPA on Flip FET with Dual-Sided Signals

Haoran Lu, Xun Jiang 0002, Yanbang Chu, Ziqiao Xu, Rui Guo, Wanyue Peng, Yibo Lin, Runsheng Wang, Heng Wu, Ru Huang 0001. A Tale of Two Sides of Wafer: Physical Implementation and Block-Level PPA on Flip FET with Dual-Sided Signals. In Design, Automation & Test in Europe Conference, DATE 2025, Lyon, France, March 31 - April 2, 2025. pages 1-7, IEEE, 2025. [doi]

Abstract

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