Semiconductor Evolution for Chip and System Design- From 2D Scaling to 3D Heterogeneous Integration

L. C. Lu. Semiconductor Evolution for Chip and System Design- From 2D Scaling to 3D Heterogeneous Integration. In 2022 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2022, Hsinchu, Taiwan, April 18-21, 2022. pages 1, IEEE, 2022. [doi]

Abstract

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