Efficient test and repair architectures for 3D TSV-based random access memories - researchr publication authors

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Shyue-Kung Lu, Uang-Chang Lu, Seng-Wen Pong, Hao-Cheng Cheng. Efficient test and repair architectures for 3D TSV-based random access memories. In 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013. pages 1-4, IEEE, 2013. [doi]

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