Shyue-Kung Lu, Uang-Chang Lu, Seng-Wen Pong, Hao-Cheng Cheng. Efficient test and repair architectures for 3D TSV-based random access memories. In 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{LuLPC13,
title = {Efficient test and repair architectures for 3D TSV-based random access memories},
author = {Shyue-Kung Lu and Uang-Chang Lu and Seng-Wen Pong and Hao-Cheng Cheng},
year = {2013},
doi = {10.1109/VLDI-DAT.2013.6533889},
url = {http://dx.doi.org/10.1109/VLDI-DAT.2013.6533889},
researchr = {https://researchr.org/publication/LuLPC13},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, April 22-24, 2013},
publisher = {IEEE},
isbn = {978-1-4673-4435-7},
}