Julia Hsin-Lin Lu, Wing-Fai Loke, Dimitrios Peroulis, Byunghoo Jung. Implementing wireless communication links in 3-D ICs utilizing wide-band on-chip meandering microbump antenna. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-5, IEEE, 2013. [doi]
@inproceedings{LuLPJ13,
title = {Implementing wireless communication links in 3-D ICs utilizing wide-band on-chip meandering microbump antenna},
author = {Julia Hsin-Lin Lu and Wing-Fai Loke and Dimitrios Peroulis and Byunghoo Jung},
year = {2013},
doi = {10.1109/3DIC.2013.6702334},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702334},
researchr = {https://researchr.org/publication/LuLPJ13},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}