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Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava. TSV-Based 3-D ICs: Design Methods and Tools. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(10):1593-1619, 2017. [doi]
Abstract is missing.