Tiantao Lu, Zhiyuan Yang, Ankur Srivastava. Electromigration-aware placement for 3D-ICs. In 17th International Symposium on Quality Electronic Design, ISQED 2016, Santa Clara, CA, USA, March 15-16, 2016. pages 35-40, IEEE, 2016. [doi]
@inproceedings{LuYS16,
title = {Electromigration-aware placement for 3D-ICs},
author = {Tiantao Lu and Zhiyuan Yang and Ankur Srivastava},
year = {2016},
doi = {10.1109/ISQED.2016.7479173},
url = {http://dx.doi.org/10.1109/ISQED.2016.7479173},
researchr = {https://researchr.org/publication/LuYS16},
cites = {0},
citedby = {0},
pages = {35-40},
booktitle = {17th International Symposium on Quality Electronic Design, ISQED 2016, Santa Clara, CA, USA, March 15-16, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1213-8},
}