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Electromigration-aware placement for 3D-ICs

Tiantao Lu, Zhiyuan Yang, Ankur Srivastava. Electromigration-aware placement for 3D-ICs. In 17th International Symposium on Quality Electronic Design, ISQED 2016, Santa Clara, CA, USA, March 15-16, 2016. pages 35-40, IEEE, 2016. [doi]

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