Towards an inductively coupled power/data link for bondpad-less silicon chips

Song Luan, Amir Eftekhar, Olive H. Murphy, Timothy G. Constandinou. Towards an inductively coupled power/data link for bondpad-less silicon chips. In International Symposium on Circuits and Systems (ISCAS 2011), May 15-19 2011, Rio de Janeiro, Brazil. pages 2597-2600, IEEE, 2011. [doi]

Abstract

Abstract is missing.