TSV fault-tolerant mechanisms with application to 3D clock networks

Chiao-Ling Lung, Jui-Hung Chien, Yiyu Shi, Shih-Chieh Chang. TSV fault-tolerant mechanisms with application to 3D clock networks. In International SoC Design Conference, ISOCC 2011, Jeju, South Korea, November 17-18, 2011. pages 127-130, IEEE, 2011. [doi]

Abstract

Abstract is missing.