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Study on low-Ag content Sn-Ag-Zn/Cu solder joints

Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li. Study on low-Ag content Sn-Ag-Zn/Cu solder joints. Microelectronics Reliability, 53(12):2018-2029, 2013. [doi]

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Tingbi Luo

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Zhuo Chen

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Anmin Hu

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Ming Li

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Peng Li

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