Study on low-Ag content Sn-Ag-Zn/Cu solder joints

Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li. Study on low-Ag content Sn-Ag-Zn/Cu solder joints. Microelectronics Reliability, 53(12):2018-2029, 2013. [doi]

Authors

Tingbi Luo

This author has not been identified. Look up 'Tingbi Luo' in Google

Zhuo Chen

This author has not been identified. Look up 'Zhuo Chen' in Google

Anmin Hu

This author has not been identified. Look up 'Anmin Hu' in Google

Ming Li

This author has not been identified. Look up 'Ming Li' in Google

Peng Li

This author has not been identified. Look up 'Peng Li' in Google