Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li. Study on low-Ag content Sn-Ag-Zn/Cu solder joints. Microelectronics Reliability, 53(12):2018-2029, 2013. [doi]
@article{LuoCHLL13,
title = {Study on low-Ag content Sn-Ag-Zn/Cu solder joints},
author = {Tingbi Luo and Zhuo Chen and Anmin Hu and Ming Li and Peng Li},
year = {2013},
doi = {10.1016/j.microrel.2013.06.010},
url = {http://dx.doi.org/10.1016/j.microrel.2013.06.010},
researchr = {https://researchr.org/publication/LuoCHLL13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {12},
pages = {2018-2029},
}