Study on low-Ag content Sn-Ag-Zn/Cu solder joints

Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li. Study on low-Ag content Sn-Ag-Zn/Cu solder joints. Microelectronics Reliability, 53(12):2018-2029, 2013. [doi]

Abstract

Abstract is missing.