A Thermal-Mechanical Deformation Based Fault Diagnosis Method Utilizing Support Vector Machine Algorithm for IGBT Bonding Wire Crack Detection

Jun Luo, Cong Chen, Jiahao Wang, Libing Bai, Lulu Tian, Jie Zhang, Quan Zhou, Yuhua Cheng. A Thermal-Mechanical Deformation Based Fault Diagnosis Method Utilizing Support Vector Machine Algorithm for IGBT Bonding Wire Crack Detection. In CAA Symposium on Fault Detection, Supervision, and Safety for Technical Processes, SAFEPROCESS 2021, Chengdu, China, December 17-18, 2021. pages 1-4, IEEE, 2021. [doi]

Abstract

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