The following publications are possibly variants of this publication:
- Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking ConditionCong Chen, Libing Bai, Jun Luo, Jiahao Wang, Quan Zhou, Jie Zhang 0086, Lulu Tian, Wei Huang, Yuhua Cheng 0001. iecon 2022: 1-6 [doi]
- Personalized Web Information Recommendation Algorithm Based on Support Vector MachineYu Bo, Qi Luo. ipc 2007: 487-490 [doi]
- Analog Circuit Fault Fusion Diagnosis Method Based on Support Vector MachineZhihong Feng, Zhigui Lin, Wei Fang, Wei Wang, Zhitao Xiao. isnn 2009: 225-234 [doi]
- In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on Collector Voltage UndershootWuyu Zhang, Kun Tan, Bing Ji, Lei Qi, Xiang Cui, Xiangyu Zhang 0004, Luchun Du. tie, 70(3):3045-3054, 2023. [doi]
- Fault diagnosis of power transformer based on support vector machine with genetic algorithmSheng-wei Fei, Xiao-bin Zhang. eswa, 36(8):11352-11357, 2009. [doi]
- Active Learning of Support Vector Machine for Fault Diagnosis of BearingsZhousuo Zhang, Wenzhi Lv, Minghui Shen. isnn 2006: 390-395 [doi]