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Impedance discontinuity compensation and optimization for interconnection of coaxial TSV and RDL based on the principle of open stub matching

Xin Luo, Gang Dong, Changle Zhi, Xinqing Lei, Shiping Mao. Impedance discontinuity compensation and optimization for interconnection of coaxial TSV and RDL based on the principle of open stub matching. Microelectronics Journal, 175:107327, 2026. [doi]

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