A scalable modular architecture of 3D object acquisition for manufacturing automation

Ren C. Luo, Chia-Wen Kuo. A scalable modular architecture of 3D object acquisition for manufacturing automation. In 13th IEEE International Conference on Industrial Informatics, INDIN 2015, Cambridge, United Kingdom, July 22-24, 2015. pages 269-274, IEEE, 2015. [doi]

Abstract

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