An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness

Guojie Luo, Yiyu Shi, Jason Cong. An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(4):510-523, 2013. [doi]

Abstract

Abstract is missing.