Improved Model for ESD Failure Caused by Stressing No Connect Pin

Jingrui Ma, Qi-An Xu, Blacksmith Wu, Kanyu Cao. Improved Model for ESD Failure Caused by Stressing No Connect Pin. In 13th IEEE International Conference on ASIC, ASICON 2019, Chongqing, China, October 29 - November 1, 2019. pages 1-4, IEEE, 2019. [doi]

Abstract

Abstract is missing.