Liam Madden, Ephrem Wu, Namhoon Kim, Bahareh Banijamali, Khaldoon Abugharbieh, Suresh Ramalingam, Xin Wu. Advancing high performance heterogeneous integration through die stacking. In Proceedings of the 38th European Solid-State Circuit conference, ESSCIRC 2012, Bordeaux, France, September 17-21, 2012. pages 18-24, IEEE, 2012. [doi]
Abstract is missing.