Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel. Integration of intra chip stack fluidic cooling using thin-layer solder bonding. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-8, IEEE, 2013. [doi]
@inproceedings{MadhourZSBLTM13,
title = {Integration of intra chip stack fluidic cooling using thin-layer solder bonding},
author = {Yassir Madhour and Michael Zervas and Gerd Schlottig and Thomas Brunschwiler and Yusuf Leblebici and John Richard Thome and Bruno Michel},
year = {2013},
doi = {10.1109/3DIC.2013.6702343},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702343},
researchr = {https://researchr.org/publication/MadhourZSBLTM13},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}